By Jim Mellon, Al Chalabi
Jim Mellon & Al Chalabi's explosive new ebook 'Fast Forward'. because the velocity of technological growth intensifies, agile companies and marketers are getting to know new functions that make the most of speedier and less expensive laptop processing strength. the established order is being upended throughout all industries, and often times absolutely new industries are being created. quick ahead is a booklet that filters this chaotic panorama and identifies the parts that would have the best influence to our lives, highlighting funding possibilities alongside the way in which. those disruptive applied sciences span the fields of robotics, transportation, the altering web, lifestyles sciences, 3D printing and effort, all of that are experiencing large progress. With their earlier books released during the last nine years, Mellon and Chalabi have tested a good music checklist of spotting funding possibilities prior to they develop into mainstream, beginning with forecasting the good Recession in 2005, and picking gold as a good hedge. extra lately, they've got written approximately existence sciences, and their advised shares in "Cracking the Code" have outperformed each significant industry on the earth.
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583-585. [9] E. Prochnow and D. F. Edwards: Applied Optics, Vol. 25 (1986), pp. 2639-2640. Q. Wang: Lapping/Polishing Machine for Optical Parts and its Application in Lapping/ Polishing Sapphire Wafers, CN Patent 1,546,283, 2003. S. F. M. Grimes: Semiconductor International, Vol. 18 (1995), pp. 115 -118. [12] T. Fukami, H. Masumura, K. Suzuki and H. Kudo: Method of Manufacturing Semiconductor Mirror Wafers, European Patent Application EP0782179A2, 1997. J. R. Billingsley and S. Miura: International Journal of Machine Tools and Manufacture, Vol.
Laser Technologies. Laser technology in assisting grinding was first proposed by Westkamper [2] for dressing and truing of CBN grinding wheels. Laser dressing poses the risk of thermal damage, bond material resolidification (in case of metal bond), grit damage or graphitization of diamond grits and high initial setup cost, but Hosokawa [3] reported successful elimination of most of these problems with Nd:YAG laser. Laser assisted mechanical dressing uses laser irradiation to soften the bond material and the following cutter removes it with ease [4].
18 (1995), pp. 115 -118. [12] T. Fukami, H. Masumura, K. Suzuki and H. Kudo: Method of Manufacturing Semiconductor Mirror Wafers, European Patent Application EP0782179A2, 1997. J. R. Billingsley and S. Miura: International Journal of Machine Tools and Manufacture, Vol. 39 (1999), pp. 1103–1116. J. Pietsch and M. Kerstan: Simultaneous Double-disk Grinding Machining Process for Flat, Low-damage and Material-saving Silicon Wafer Substrate Manufacturing, Proceeding of the 2nd Euspen International Conference, Turin, Italy, (2001), pp.