By Xipeng Xu
The grinding and abrasive processing of fabrics are machining suggestions which use bonded or unfastened abrasives to take away fabric from workpieces. a result of recognized benefits of grinding and abrasive methods, advances in abrasive and grinding know-how are continually of serious import in bettering either productiveness and part caliber. as a way to spotlight the new growth made during this box, the editor Read more...
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Progress in abrasive and grinding technology : special topic volume with invited papers only
The grinding and abrasive processing of fabrics are machining options which use bonded or unfastened abrasives to take away fabric from workpieces. as a result of the famous benefits of grinding and abrasive procedures, advances in abrasive and grinding expertise are regularly of serious import in bettering either productiveness and part caliber.
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583-585. [9] E. Prochnow and D. F. Edwards: Applied Optics, Vol. 25 (1986), pp. 2639-2640. Q. Wang: Lapping/Polishing Machine for Optical Parts and its Application in Lapping/ Polishing Sapphire Wafers, CN Patent 1,546,283, 2003. S. F. M. Grimes: Semiconductor International, Vol. 18 (1995), pp. 115 -118. [12] T. Fukami, H. Masumura, K. Suzuki and H. Kudo: Method of Manufacturing Semiconductor Mirror Wafers, European Patent Application EP0782179A2, 1997. J. R. Billingsley and S. Miura: International Journal of Machine Tools and Manufacture, Vol.
Laser Technologies. Laser technology in assisting grinding was first proposed by Westkamper [2] for dressing and truing of CBN grinding wheels. Laser dressing poses the risk of thermal damage, bond material resolidification (in case of metal bond), grit damage or graphitization of diamond grits and high initial setup cost, but Hosokawa [3] reported successful elimination of most of these problems with Nd:YAG laser. Laser assisted mechanical dressing uses laser irradiation to soften the bond material and the following cutter removes it with ease [4].
18 (1995), pp. 115 -118. [12] T. Fukami, H. Masumura, K. Suzuki and H. Kudo: Method of Manufacturing Semiconductor Mirror Wafers, European Patent Application EP0782179A2, 1997. J. R. Billingsley and S. Miura: International Journal of Machine Tools and Manufacture, Vol. 39 (1999), pp. 1103–1116. J. Pietsch and M. Kerstan: Simultaneous Double-disk Grinding Machining Process for Flat, Low-damage and Material-saving Silicon Wafer Substrate Manufacturing, Proceeding of the 2nd Euspen International Conference, Turin, Italy, (2001), pp.