By Rayleigh.
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In the substrate preparation step involving priming, the surface chemistry of the substrate is modified to promote the adhesion between the substrate and the resist material during coating. In the exposure process proper, exquisite radiation chemistry takes place inside the radiation sources in order to generate the exposure radiation, but also because of the interaction of these radiations—be they photons, ions, electrons, x rays—with the outer-shell electrons of the radiation-sensitive compounds and molecules in the resist, leading to bond breakage and/or bond formation.
This is the basis of the contrast between the exposed and unexposed areas of the resist film. The main attribute of optical lithography that made it the manufacturing technology of choice for ICs since the beginning of the IC era is the tremendous throughput advantages it offers through its ability to reproduce an entire IC layout from a master (or reticle) in a single exposure, in contrast to other technologies that address a field point by point. In addition to the compelling throughput advantages, there were resolution and cost advantages as well.
Once etched and stripped of all the varnish, he could then use the plate for printing. In an 1824 letter he sent to his brother Claude, Nice´phore wrote that he had succeeded in obtaining direct images on stone and glass that then could be etched and used for printing. 45 At about that same time, Nice´phore began to experiment with pewter plates. Possessing a lighter and more natural color than the copper and zinc plates he had been using, pewter allowed him to attain a greater range of tones. In 1826, using a polished pewter plate to which he added a thin film of light-sensitive substance called asphalt or bitumen of Judea that was exposed to an image of his courtyard and garden from his window with the aid of a simple camera obscura, he obtained the first successful direct camera image—an image of the courtyard of his country estate Le Gras in the village of St.